The global artificial intelligence semiconductor race is entering a new phase, one in which progress will increasingly depend not only on transistor density or fabrication nodes, but also on how chips are packaged, interconnected, cooled, and powered. Huawei appears to be positioning itself for that shift. Reports indicate that Huawei is working with domestic semiconductor suppliers on advanced glass substrate technologies, including Through-Glass Via, or TGV, and glass interposers, with the...

The convergence of artificial intelligence, computer graphics, robotics, and simulation has entered a new phase. What was once viewed as separate disciplines, GPU rendering, scientific simulation, digital content creation, and machine learning, is rapidly evolving into a unified computing ecosystem where AI serves as the connective layer between creativity, engineering, and autonomous systems. At SIGGRAPH 2026, NVIDIA presented a vision that extends well beyond faster graphics cards or...

The pursuit of commercially viable nuclear fusion has long been described as one of humanity's greatest scientific and engineering challenges. Fusion promises abundant, low-carbon energy by replicating the same process that powers the Sun, yet one critical obstacle has consistently limited progress: producing enough tritium fuel to sustain continuous fusion reactions. Recent advances in hybrid computing have opened a promising new chapter. By combining quantum computing, artificial...